Title :
Table of contents
Abstract :
The following topics are dealt with: thermal interface materials; device level thermal management and LED cooling; single phase liquid cooling; data center cooling and phase change materials; two phase liquid cooling; thermoelectronics and refrigeration; heat pipes; heat conduction; transient heat transfer; chip cooling and stacked dies; reliability; microfluidics; and nano-enhanced thermal management.
Keywords :
cooling; heat conduction; heat pipes; light emitting diodes; microfluidics; nanotechnology; semiconductor device reliability; thermal management (packaging); LED cooling; chip cooling; data center cooling; device level thermal management; heat conduction; heat pipes; liquid cooling; microfluidics; nano-enhanced thermal management; phase change material; refrigeration; reliability; stacked dies; thermal interface material; thermoelectronics; transient heat transfer;
Conference_Titel :
Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm), 2010 12th IEEE Intersociety Conference on
Conference_Location :
Las Vegas, NV
Print_ISBN :
978-1-4244-5342-9
Electronic_ISBN :
1087-9870
DOI :
10.1109/ITHERM.2010.5501340
