DocumentCode
2888924
Title
Innovative liquid cooling configurations for high heat flux applications
Author
Parida, Pritish R. ; Ekkad, Srinath V. ; Ngo, Khai
Author_Institution
Dept. of Mech. Eng., Virginia Tech, Blacksburg, VA, USA
fYear
2010
fDate
2-5 June 2010
Firstpage
1
Lastpage
8
Abstract
Breakthroughs in the recent cutting-edge technologies have become increasingly dependent on the ability to safely dissipate large amount of heat from small areas. Improvements in cooling techniques are therefore required to avoid unacceptable temperature rise and at the same time maintain a high efficiency. Jet impingement is one such cooling scheme which has been widely used to dissipate transient and steady concentrated heat loads. But with constantly increasing cooling needs, conventional jet impingement cooling is no longer a viable option. Considerable improvements are therefore required to meets such stringent requirements. A combination of swirl-impingement-fin generating geometry is one such alternative. Even without a fin, an overall enhancement of 150% - 200% in the maximum heat transfer coefficient has been recorded both experimentally and computationally due to impingement and associated swirl. Moreover, the presence of fins further increases the cooling area. The present scheme is therefore expected to overcome the existing heat distribution and cooling problems in high heat flux dissipating devices.
Keywords
cooling towers; jets; heat distribution; heat flux applications; heat flux dissipating devices; heat transfer coefficient; jet impingement; liquid cooling configurations; swirl-impingement-fin generating geometry; temperature rise; Electronics cooling; Geometry; Heat engines; Heat transfer; Liquid cooling; Resistance heating; Temperature; Thermal conductivity; Thermal management of electronics; X-ray lasers; Electronic cooling; Jet impingement; Pin-fins;
fLanguage
English
Publisher
ieee
Conference_Titel
Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm), 2010 12th IEEE Intersociety Conference on
Conference_Location
Las Vegas, NV
ISSN
1087-9870
Print_ISBN
978-1-4244-5342-9
Electronic_ISBN
1087-9870
Type
conf
DOI
10.1109/ITHERM.2010.5501356
Filename
5501356
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