Title :
A 7ns 128K multichip ECL RAM-withLogic module
Author :
Iwabuchi, Mamoru ; Ogiue, K. ; Nakamura, Kentaro ; Nakagami, S. ; Isomura, Satoru ; Kuroda, Sho ; Kawashima, S.
Author_Institution :
Hitachi Device Development Center, Tokyo, Japan
Abstract :
A RAM-with-logic multichip module containing 128Kb of RAM with 7ns access and a 700-gate logic chip of 9.2ns gate delay that has been developed, using a double-layer metal silicon substrate for a thermal stress free structure, will be discussed. Total power dissipation is 13W, thermal resistance is 2.7° C/W at 5m/s forced air flow.
Keywords :
Aluminum; Circuits; Logic; Metallization; Packaging; Parasitic capacitance; Propagation delay; Silicon carbide; Thermal stresses; Voltage;
Conference_Titel :
Solid-State Circuits Conference. Digest of Technical Papers. 1987 IEEE International
Conference_Location :
New York, NY, USA
DOI :
10.1109/ISSCC.1987.1157174
