DocumentCode :
2889084
Title :
A novel electrical test structure for measuring misalignment between polysilicon and active area in MOS VLSI technologies
Author :
Srivastava, S. ; Kansal, Alpana ; Shekhar, Chandra
Author_Institution :
Central Electron. Eng. Res. Inst., Pilani, India
fYear :
1991
fDate :
4-8 Jan 1991
Firstpage :
290
Lastpage :
292
Abstract :
A novel test structure has been designed to electrically measure the misalignment between polysilicon and the active area in MOS technologies. This alignment is one of the most critical alignments in small geometry integrated circuit processing. The structure exploits the channel width change of specially designed MOS transistors resulting from the misalignment between the active area and polysilicon layers to develop a proportionate differential current sensing arrangement. A calibrating structure is used to translate the measured differential current to actual microns
Keywords :
MOS integrated circuits; VLSI; integrated circuit technology; integrated circuit testing; spatial variables measurement; MOS VLSI; MOS transistors; active area; calibrating structure; channel width change; differential current sensing; electrical test structure; integrated circuit processing; layer misalignment measurement; mask alignment; polysilicon; small geometry; Area measurement; Circuit testing; Computational geometry; Current measurement; Electric variables measurement; Electronic equipment testing; Fabrication; Integrated circuit measurements; Integrated circuit technology; Very large scale integration;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
VLSI Design, 1991. Proceedings., Fourth CSI/IEEE International Symposium on
Conference_Location :
New Delhi
Print_ISBN :
0-8186-2125-7
Type :
conf
DOI :
10.1109/ISVD.1991.185138
Filename :
185138
Link To Document :
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