• DocumentCode
    2889319
  • Title

    Heat pipe embedded AlSiC plates for high conductivity - low CTE heat spreaders

  • Author

    Weyant, J. ; Garner, S. ; Johnson, M. ; Occhionero, M.

  • Author_Institution
    Adv. Cooling Technol., Inc., Lancaster, PA, USA
  • fYear
    2010
  • fDate
    2-5 June 2010
  • Firstpage
    1
  • Lastpage
    6
  • Abstract
    Heat pipe embedded aluminum silicon carbide (AlSiC) plates are innovative heat spreaders that provide high thermal conductivity and low coefficient of thermal expansion (CTE). Since heat pipes are two phase devices, they demonstrate effective thermal conductivities ranging between 10,000 and 200,000 W/m-K, depending on the heat pipe length. Installing heat pipes into an AlSiC plate dramatically increases the plate´s effective thermal conductivity. AlSiC plates alone have a thermal conductivity of roughly 200 W/m-K and a CTE ranging from 7-12 ppm/°C. Silicon alone has a thermal expansion coefficient of 3 ppm/°C, which makes AlSiC a much closer CTE match than tradition copper (17ppm/°C) and aluminum (25 ppm/°C) heat spreaders. An equivalent sized heat pipe embedded AlSiC plate has effective thermal conductivity ranging from 400 to 500 W/m-K..
  • Keywords
    aluminium compounds; cooling; elemental semiconductors; heat pipes; silicon compounds; thermal conductivity; thermal expansion; AlSiC; CTE heat spreaders; coefficient of thermal expansion; heat pipe embedded plates; thermal conductivities; two phase devices; Aluminum; Conducting materials; Copper; Electronic packaging thermal management; Electronics cooling; Silicon carbide; Thermal conductivity; Thermal expansion; Thermal management; Thermal stresses; Electronics Cooling; Heat Pipe; Heat Spreader; High Thermal Conductivity; Low Coefficient of Thermal Expansion (CTE); Vapor Chamber;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm), 2010 12th IEEE Intersociety Conference on
  • Conference_Location
    Las Vegas, NV
  • ISSN
    1087-9870
  • Print_ISBN
    978-1-4244-5342-9
  • Electronic_ISBN
    1087-9870
  • Type

    conf

  • DOI
    10.1109/ITHERM.2010.5501376
  • Filename
    5501376