DocumentCode :
2889412
Title :
Experimental investigation into honeycomb heat sinks incorporating varying size slots for enhanced heat transfer
Author :
Hernon, Domhnaill
Author_Institution :
Bell Labs., Alcatel-Lucent Ireland, Dublin, Ireland
fYear :
2010
fDate :
2-5 June 2010
Firstpage :
1
Lastpage :
7
Abstract :
In this experimental investigation novel honeycomb heat sink designs that incorporate slots of varying length are presented. Thermal and hydrodynamic performance comparisons are made for a longitudinally-finned heat sink, a wavy wall heat sink of the same geometric dimensions, a closed channel honeycomb heat sink and a number of honeycomb heat sinks with different length (3mm, 6mm and 13mm) of vertically orientated slot. The heat sinks are manufactured using an investment casting process which provides a means of fabricating complex designs as one monolithic structure with high thermal conductivity that would not otherwise be possible using traditional techniques. It is demonstrated that enhanced heat transfer was achieved with the introduction of vertically oriented slots into the closed channel honeycomb structure. It is found that there is an optimum slot length per unit length of the heat sink and in the current experimental range the best performance was observed with 6mm length slots.
Keywords :
heat sinks; heat transfer; honeycomb structures; investment casting; thermal conductivity; thermal management (packaging); heat transfer; honeycomb heat sink; hydrodynamic performance; investment casting process; monolithic structure; size 13 mm; size 3 mm; size 6 mm; thermal conductivity; thermal performance; Electronic packaging thermal management; Heat pumps; Heat sinks; Heat transfer; Honeycomb structures; Telecommunication standards; Thermal conductivity; Thermal expansion; Thermal management; Thermal resistance; Enhanced heat transfer; Experimental investigation; Honeycomb heat sinks; Investment Casting;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm), 2010 12th IEEE Intersociety Conference on
Conference_Location :
Las Vegas, NV
ISSN :
1087-9870
Print_ISBN :
978-1-4244-5342-9
Electronic_ISBN :
1087-9870
Type :
conf
DOI :
10.1109/ITHERM.2010.5501381
Filename :
5501381
Link To Document :
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