DocumentCode
2889437
Title
Experimental identification of evaporator dynamics for vapor compression refrigeration cycle during phase transition
Author
Catano, Juan E. ; Zhang, TieJun ; Peles, Yoav ; Jensen, Michael K. ; Wen, John T.
Author_Institution
Dept. of Mech., Aerosp., & Nucl. Eng., Rensselaer Polytech. Inst., Troy, NY, USA
fYear
2010
fDate
2-5 June 2010
Firstpage
1
Lastpage
5
Abstract
Experimental identification of the evaporator dynamics in a vapor compression cycle (VCC) subjected to imposed heat flux in the evaporator is studied. The imposed heat flux boundary condition represents a specific application of the VCC for electronics cooling. However, this application requires different models and control algorithms than traditional VCCs with fluid-to-fluid heat exchanges because of the faster time response of the imposed heat flux boundary condition and because the refrigerant flow at the exit of the evaporator is expected to be a two-phase mixture. First principle models are highly nonlinear and, hence, are not practical for system control. To obtain a simplified model, a dynamic identification of component response characteristics is performed by applying a pulse change in the system operating conditions (i.e., the heat load to the evaporator, the expansion valve opening, or the compressor speed). It is shown that for changes in expansion valve opening, the temperature of the refrigerant at the exit of the evaporator has opposite trends when the flow is initially in the two-phase region and when the flow is in the superheated region. This phenomena represents a challenge for controller design, and further investigation is required.
Keywords
evaporation; heat transfer; refrigeration; two-phase flow; electronics cooling; evaporator dynamics; fluid-to-fluid heat exchanges; heat flux; phase transition; two-phase mixture; vapor compression refrigeration cycle; Boundary conditions; Control system synthesis; Electronics cooling; Fluid dynamics; Fluid flow control; Refrigerants; Refrigeration; Temperature control; Time factors; Valves;
fLanguage
English
Publisher
ieee
Conference_Titel
Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm), 2010 12th IEEE Intersociety Conference on
Conference_Location
Las Vegas, NV
ISSN
1087-9870
Print_ISBN
978-1-4244-5342-9
Electronic_ISBN
1087-9870
Type
conf
DOI
10.1109/ITHERM.2010.5501383
Filename
5501383
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