• DocumentCode
    2889437
  • Title

    Experimental identification of evaporator dynamics for vapor compression refrigeration cycle during phase transition

  • Author

    Catano, Juan E. ; Zhang, TieJun ; Peles, Yoav ; Jensen, Michael K. ; Wen, John T.

  • Author_Institution
    Dept. of Mech., Aerosp., & Nucl. Eng., Rensselaer Polytech. Inst., Troy, NY, USA
  • fYear
    2010
  • fDate
    2-5 June 2010
  • Firstpage
    1
  • Lastpage
    5
  • Abstract
    Experimental identification of the evaporator dynamics in a vapor compression cycle (VCC) subjected to imposed heat flux in the evaporator is studied. The imposed heat flux boundary condition represents a specific application of the VCC for electronics cooling. However, this application requires different models and control algorithms than traditional VCCs with fluid-to-fluid heat exchanges because of the faster time response of the imposed heat flux boundary condition and because the refrigerant flow at the exit of the evaporator is expected to be a two-phase mixture. First principle models are highly nonlinear and, hence, are not practical for system control. To obtain a simplified model, a dynamic identification of component response characteristics is performed by applying a pulse change in the system operating conditions (i.e., the heat load to the evaporator, the expansion valve opening, or the compressor speed). It is shown that for changes in expansion valve opening, the temperature of the refrigerant at the exit of the evaporator has opposite trends when the flow is initially in the two-phase region and when the flow is in the superheated region. This phenomena represents a challenge for controller design, and further investigation is required.
  • Keywords
    evaporation; heat transfer; refrigeration; two-phase flow; electronics cooling; evaporator dynamics; fluid-to-fluid heat exchanges; heat flux; phase transition; two-phase mixture; vapor compression refrigeration cycle; Boundary conditions; Control system synthesis; Electronics cooling; Fluid dynamics; Fluid flow control; Refrigerants; Refrigeration; Temperature control; Time factors; Valves;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm), 2010 12th IEEE Intersociety Conference on
  • Conference_Location
    Las Vegas, NV
  • ISSN
    1087-9870
  • Print_ISBN
    978-1-4244-5342-9
  • Electronic_ISBN
    1087-9870
  • Type

    conf

  • DOI
    10.1109/ITHERM.2010.5501383
  • Filename
    5501383