DocumentCode
2889918
Title
Multiphysics optimization, synthesis, and application of jet impingement target surfaces
Author
Dede, Ercan M.
Author_Institution
Toyota Res. Inst. of North America, Toyota Motor Eng. & Manuf. of North America, Ann Arbor, MI, USA
fYear
2010
fDate
2-5 June 2010
Firstpage
1
Lastpage
7
Abstract
This paper is focused on the synthesis and application of optimized jet impingement target surfaces for electronics device cooling. A multiphysics topology optimization method is reviewed along with two-dimensional results for an optimal local jet impingement heat transfer surface. Multiple surface topologies are utilized as building blocks in the development of a three-dimensional cooling structure having a mini-scale textured surface for jet impingement. The thermal and fluid performance of this structure is compared with that of a benchmark structure using respective multiphysics finite element models comprising a generic electronics package. Conjugate heat transfer and fluid flow results indicate that the optimized jet impingement surface reduces device temperature at the cost of increased pressure drop. The highlighted optimization and synthesis procedure represents a unique approach to the design of complex multiphysics cooling systems.
Keywords
heat transfer; jets; electronics device cooling; finite element models; heat transfer surface; jet impingement target surfaces; multiphysics optimization; multiple surface topologies; Circuit topology; Cost function; Electronic packaging thermal management; Electronics cooling; Finite element methods; Fluid flow; Heat transfer; Optimization methods; Surface texture; Temperature; electronics; fluid; jet impingement; thermal; topology optimization;
fLanguage
English
Publisher
ieee
Conference_Titel
Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm), 2010 12th IEEE Intersociety Conference on
Conference_Location
Las Vegas, NV
ISSN
1087-9870
Print_ISBN
978-1-4244-5342-9
Electronic_ISBN
1087-9870
Type
conf
DOI
10.1109/ITHERM.2010.5501408
Filename
5501408
Link To Document