• DocumentCode
    2889918
  • Title

    Multiphysics optimization, synthesis, and application of jet impingement target surfaces

  • Author

    Dede, Ercan M.

  • Author_Institution
    Toyota Res. Inst. of North America, Toyota Motor Eng. & Manuf. of North America, Ann Arbor, MI, USA
  • fYear
    2010
  • fDate
    2-5 June 2010
  • Firstpage
    1
  • Lastpage
    7
  • Abstract
    This paper is focused on the synthesis and application of optimized jet impingement target surfaces for electronics device cooling. A multiphysics topology optimization method is reviewed along with two-dimensional results for an optimal local jet impingement heat transfer surface. Multiple surface topologies are utilized as building blocks in the development of a three-dimensional cooling structure having a mini-scale textured surface for jet impingement. The thermal and fluid performance of this structure is compared with that of a benchmark structure using respective multiphysics finite element models comprising a generic electronics package. Conjugate heat transfer and fluid flow results indicate that the optimized jet impingement surface reduces device temperature at the cost of increased pressure drop. The highlighted optimization and synthesis procedure represents a unique approach to the design of complex multiphysics cooling systems.
  • Keywords
    heat transfer; jets; electronics device cooling; finite element models; heat transfer surface; jet impingement target surfaces; multiphysics optimization; multiple surface topologies; Circuit topology; Cost function; Electronic packaging thermal management; Electronics cooling; Finite element methods; Fluid flow; Heat transfer; Optimization methods; Surface texture; Temperature; electronics; fluid; jet impingement; thermal; topology optimization;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm), 2010 12th IEEE Intersociety Conference on
  • Conference_Location
    Las Vegas, NV
  • ISSN
    1087-9870
  • Print_ISBN
    978-1-4244-5342-9
  • Electronic_ISBN
    1087-9870
  • Type

    conf

  • DOI
    10.1109/ITHERM.2010.5501408
  • Filename
    5501408