• DocumentCode
    2889978
  • Title

    Characterization of the manufacturing worthiness of semiconductor process equipment

  • Author

    Grewal, Gulsher ; Newberry, Stephen G. ; Toole, Dave

  • Author_Institution
    Intel Corp., Santa Clara, CA, USA
  • fYear
    1989
  • fDate
    22-24 May 1989
  • Firstpage
    73
  • Lastpage
    77
  • Abstract
    In order to achieve world-class competitive manufacturing capability, the concept of supplier partnerships was developed, with a win-win approach. Total equipment performance, which included process and manufacturing capability, strong vendor relationships, vendor contract maintenance, training, field service support, and continuous improvement methodology, was emphasized. An off-site, nonproduction facility was set up to help develop manufacturable solutions. The equipment set was exercised in the facility to simulate a volume production environment. The purpose of the exercise was to prove that the equipment can meet the intended need. Process and hardware capability of the equipment set was evaluated and documented over a large wafer volume. The result of this methodology was qualified production at high volume
  • Keywords
    integrated circuit manufacture; management; competitive manufacturing capability; continuous improvement methodology; equipment characterisation; equipment evaluation; field service support; hardware capability; large wafer volume; manufacturing capability; manufacturing worthiness of semiconductor process equipment; qualified production; strong vendor relationships; supplier partnerships; training; vendor contract maintenance; volume production environment; win-win approach; Continuous improvement; Etching; Manufacturing processes; Marketing and sales; Plasma applications; Plasma materials processing; Production; Pulp manufacturing; Semiconductor device manufacture; Semiconductor materials;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Semiconductor Manufacturing Science Symposium, 1989. ISMSS 1989., IEEE/SEMI International
  • Conference_Location
    Burlingame, CA
  • Type

    conf

  • DOI
    10.1109/ISMSS.1989.77248
  • Filename
    77248