Design of a submicron facility with SMIF optimized cleanroom system

Author

Wiemer, K. ; Simon, R. ; Parikh, M.

Author_Institution

Taiwan Semicond. Manuf. Co., Taipei, Taiwan

fYear

1989

fDate

22-24 May 1989

Firstpage

82

Lastpage

84

Abstract

A facility for submicron VLSI chip manufacturing has been designed with the concept of the SMIF (standard mechanical interface) optimized cleanroom system. This facility involves an 80000 square foot cleanroom with a class 1000 ambient nonlaminar air flow, with equipment isolated in subclass 1 islands, each with SMIF interfaces. Significant reduction in the clean air requirements resulted in a reduction in air handling requirements, thereby leading to reduced construction and operating costs. Isolated subclass 1 islands provide assured cleanliness even in the event of external contamination disturbances. In effect, class 1 is assured immediately above the exposed wafers in such a facility as compared to at-the-ceiling as in a conventional cleanroom. Facility design concepts and estimates of cost savings in facility construction and operation are presented

Keywords

integrated circuit manufacture; SMIF interfaces; SMIF optimized cleanroom system; ambient nonlaminar air flow; class 1; class 1000; clean air requirements; construction costs reduction; cost savings; design concepts; operating costs; reduction in air handling requirements; standard mechanical interface; subclass 1 islands; submicron VLSI chip manufacturing; submicron facility; Application specific integrated circuits; Costs; Design optimization; Foot; Foundries; Isolation technology; Manufacturing automation; Manufacturing processes; Production; Semiconductor device manufacture;

fLanguage

English

Publisher

ieee

Conference_Titel

Semiconductor Manufacturing Science Symposium, 1989. ISMSS 1989., IEEE/SEMI International

Conference_Location

Burlingame, CA

Type

conf

DOI

10.1109/ISMSS.1989.77250

Filename

77250