Integrated electrical and thermal modeling and analysis of IPEMs

Author

Chen, Jonah Z. ; Wu, Yingxiang ; Borojevich, Dushan ; Bohn, Jan H.

Author_Institution

Bradley Dept. of Electr. Eng., Virginia Polytech. Inst. & State Univ., Blacksburg, VA, USA

fYear

2000

fDate

2000

Firstpage

24

Lastpage

27

Abstract

The need for integrated analysis and design tools is becoming more evident, especially when integrated power electronics module (IPEM) is concerned. The whole procedure of developing IPEM needs the support from integrated tools. In this paper, a set of IPEM models has been developed. This includes a 3D solid model by I-DEAS, parasitic model by Maxwell, thermal model by FLOTHERM and electrical model by Saber. The exchange of geometry information among these models has been achieved. Furthermore, based on these models, this paper explores the tradeoff between minimizing parasitics and improving thermal performance

Keywords

electronic engineering computing; heat sinks; modules; power MOSFET; power electronics; thermal analysis; 3D solid model; FLOTHERM; I-DEAS; Maxwell; Saber; electrical model; electrical modeling; geometry information; heat sinks; integrated power electronics module; parasitic model; parasitics minimisation; power MOSFET; thermal model; thermal modeling; thermal performance improvement; Aluminum oxide; Copper; Data mining; Electronic equipment testing; Information geometry; MOSFETs; Performance analysis; Power electronics; Power system modeling; Solid modeling;

fLanguage

English

Publisher

ieee

Conference_Titel

Computers in Power Electronics, 2000. COMPEL 2000. The 7th Workshop on

Conference_Location

Blacksburg, VA

Print_ISBN

0-7803-6561-5

Type

conf

DOI

10.1109/CIPE.2000.904686

Filename

904686