DocumentCode
2890044
Title
Design for inherent manufacturability of electronic products
Author
Miller, William H., Jr. ; Sanders, Thomas J.
Author_Institution
Harris Semicond., Melbourne, FL, USA
fYear
1989
fDate
22-24 May 1989
Firstpage
85
Lastpage
91
Abstract
The principal goal of an integrated circuit DFM (design for manufacturing) initiative is to insure arrival at electrical circuit designs and packaged IC components which are inherently producible within the manufacturing environment. In order to achieve this objective the component design must, from early in the product concept phase, incorporate a full range of manufacturing production constraints and considerations. DFM not only implies designing for physical product fabrication but also must include design for testability, design for assembly or packaging, design for reliability and integration, and networking of all these areas. The key to the success of a DFM program lies in increased accuracy in the modeling of the process and product designs, product simulations, and effective manufacturing feedback of key parametric data. Factory fabrication efficiency increases as the design accuracy and tolerances increase. Statistically valid models, extracted from and representative of the controlled process, can be fed back to product designers via advanced CAD/CAM/CAE integrated systems, thus reducing design cycle times by limiting the design space to be explored in order to achieve a predetermined product yield
Keywords
integrated circuit manufacture; integrated circuit technology; design for assembly; design for manufacturing; design for reliability; design for testability; electrical circuit designs; inherent manufacturability of electronic products; integrated circuit DFM; manufacturing production constraints; packaged IC components; physical product fabrication; reducing design cycle times; Circuit synthesis; Design for manufacture; Electronics packaging; Fabrication; Integrated circuit manufacture; Integrated circuit packaging; Manufacturing; Product design; Production; Space exploration;
fLanguage
English
Publisher
ieee
Conference_Titel
Semiconductor Manufacturing Science Symposium, 1989. ISMSS 1989., IEEE/SEMI International
Conference_Location
Burlingame, CA
Type
conf
DOI
10.1109/ISMSS.1989.77251
Filename
77251
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