DocumentCode
2890049
Title
Pressure effects on the pool boiling of the fluorinated ketone C2 F5 C(O)CF(CF3 )2
Author
Forrest, Eric C. ; Hu, Lin-wen ; McKrell, Thomas J. ; Buongiorno, Jacopo ; Ostrovsky, Yakov
Author_Institution
Dept. of Nucl. Sci. & Eng., Massachusetts Inst. of Technol., Cambridge, MA, USA
fYear
2010
fDate
2-5 June 2010
Firstpage
1
Lastpage
9
Abstract
A low global warming potential dielectric fluid is under investigation for use in two-phase electronic cooling systems. The fluorinated ketone C2F5C(O)CF(CF3)2, sufficient for either indirect cooling or direct immersion cooling, may be an environmentally friendly alternative for the cooling of power electronics and other high power density devices. This study examines pressure effects on the pool boiling heat transfer coefficient and critical heat flux of the fluorinated ketone. Using a pressurized boiling facility, an aluminum substrate is heated by conduction with a cartridge heater. By measuring the surface temperature and surface heat flux, the nucleate boiling heat transfer coefficient and critical heat flux are obtained for the fluorinated ketone under saturated conditions at various system pressures. Results are compared to the pool boiling of tetrafluoroethane (R-134a) in the same pressurized facility. Data are fitted using the Rohsenow correlation and surface-fluids parameters for R-134a and the fluorinated ketone are determined. Data indicate that the CHF and nucleate boiling heat transfer coefficient of the fluorinated ketone may be increased with only modest increases in the system pressure.
Keywords
boiling; heat transfer; two-phase flow; R-134a; aluminum substrate; cartridge heater; critical heat flux; fluorinated ketone; global warming potential dielectric fluid; heat transfer; high power density devices; pool boiling; power electronics; surface heat flux; surface temperature; tetrafluoroethane; two-phase electronic cooling systems; Aluminum; Dielectrics; Electronics cooling; Global warming; Heat transfer; Immersion cooling; Nuclear measurements; Power electronics; Pressure effects; Temperature measurement; CHF; FK-649; Novec™; dielectric fluid; fluorinated ketone; immersion cooling; low GWP fluid; pool boiling;
fLanguage
English
Publisher
ieee
Conference_Titel
Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm), 2010 12th IEEE Intersociety Conference on
Conference_Location
Las Vegas, NV
ISSN
1087-9870
Print_ISBN
978-1-4244-5342-9
Electronic_ISBN
1087-9870
Type
conf
DOI
10.1109/ITHERM.2010.5501414
Filename
5501414
Link To Document