• DocumentCode
    2890168
  • Title

    Numerical modeling of data center with transient boundary conditions

  • Author

    Gondipalli, Srujan ; Ibrahim, Mahmoud ; Bhopte, Siddharth ; Sammakia, Bahgat ; Murray, Bruce ; Ghose, Kanad ; Iyengar, Madhusudan K. ; Schmidt, Roger

  • Author_Institution
    State Univ. of New York at Binghamton, Binghamton, NY, USA
  • fYear
    2010
  • fDate
    2-5 June 2010
  • Firstpage
    1
  • Lastpage
    7
  • Abstract
    Data centers are the facilities that house large number of computer servers that dissipate high power. Considering the dynamics of the data centers, their efficient thermal management is a big challenge that needs to be addressed. Computational analyses using a CFD code is very useful technique that helps the engineer to understand and solve the data center cooling problem. Several ongoing numerical modeling research efforts focus on simulating data center environment with constant boundary conditions. In reality, data centers have highly time dependent boundary conditions i.e. fluctuations in server powers and CRAC flow rate. In this paper, effect on time dependent boundary conditions on rack inlet temperatures will be discussed in detail with the transient modeling of data centers. Case studies will be presented to illustrate the transient fluctuations of rack inlet air temperature by the variation of rack power and CRAC flow rate.
  • Keywords
    computer centres; numerical analysis; power aware computing; CFD code; CRAC flow rate; data center; data center cooling problem; numerical modeling; server powers; thermal management; time dependent boundary conditions; transient boundary conditions; Boundary conditions; Computational fluid dynamics; Computational modeling; Cooling; Data engineering; Fluctuations; Numerical models; Power engineering and energy; Power engineering computing; Thermal management; Data Center; Flotherm; Numerical Modeling; Transient Analysis; Transient Boundary Conditions;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm), 2010 12th IEEE Intersociety Conference on
  • Conference_Location
    Las Vegas, NV
  • ISSN
    1087-9870
  • Print_ISBN
    978-1-4244-5342-9
  • Electronic_ISBN
    1087-9870
  • Type

    conf

  • DOI
    10.1109/ITHERM.2010.5501420
  • Filename
    5501420