DocumentCode
2890301
Title
Numerical simulation of thermal management with heat sink composites
Author
Fiedler, T. ; Veyhl, C. ; Belova, I.V. ; Murch, G.E.
Author_Institution
Univ. of Newcastle, Callaghan, NSW, Australia
fYear
2010
fDate
2-5 June 2010
Firstpage
1
Lastpage
5
Abstract
This paper focuses on thermal management using advanced heat sink composites. The considered composite structures are assembled by M-Pore® cellular metals matrices and the phase change material: paraffin. The general idea is to use a highly thermal conducting matrix to transfer thermal energy into the composite and then to store thermal energy within the phase change material. Advanced heat sink composite structures may be used for thermal energy storage as well as temperature stabilization of sensitive components. Finite element analysis on the effective thermal properties of the cellular metal is performed. Calculation models are based on computed tomography data in order to capture the complex meso-structure of these materials. Special focus is given to the size of the representative volume and thermal anisotropy. In addition, a recently extended Lattice Monte Carlo method is applied towards the simulation of transient heat transfer accounting for the phase change of the paraffin and temperature dependent material properties.
Keywords
Monte Carlo methods; composite materials; finite element analysis; heat sinks; heat transfer; phase change materials; thermal conductivity; thermal energy storage; thermal management (packaging); thermal stability; M-Pore cellular metals matrix; composite structure; computed tomography data; finite element analysis; heat sink composites; lattice Monte Carlo method; numerical simulation; paraffin; phase change material; temperature stabilization; thermal anisotropy; thermal conducting matrix; thermal energy storage; thermal energy transfer; thermal management; thermal property; transient heat transfer; Assembly; Energy storage; Finite element methods; Heat sinks; Numerical simulation; Performance analysis; Phase change materials; Temperature sensors; Thermal conductivity; Thermal management; Lattice Monte Carlo method; composite; finite element method; heat sink;
fLanguage
English
Publisher
ieee
Conference_Titel
Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm), 2010 12th IEEE Intersociety Conference on
Conference_Location
Las Vegas, NV
ISSN
1087-9870
Print_ISBN
978-1-4244-5342-9
Electronic_ISBN
1087-9870
Type
conf
DOI
10.1109/ITHERM.2010.5501427
Filename
5501427
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