• DocumentCode
    2890345
  • Title

    Simulation of anisotropic breakdown in 4H-SiC diodes

  • Author

    Bertilsson, K. ; Nilsson, H.E. ; Petersson, C.S.

  • Author_Institution
    Dept. of Inf. Technol., Mid-Sweden Univ., Sundsvall, Sweden
  • fYear
    2000
  • fDate
    2000
  • Firstpage
    118
  • Lastpage
    120
  • Abstract
    The breakdown characteristics of two-dimensional 4H-SiC diode structures have been studied using an anisotropic drift-diffusion model. The degree of anisotropy was estimated from recent full band Monte Carlo simulations. Identical diode structures have previously been used in the literature to measure the hole impact ionization coefficients of 4H-SiC. The reported measurements from different research groups show large differences in the impact ionization coefficients. The authors´ numerical simulations show that the differences in these measurements can be explained by the difference in device geometry used by the research teams a one considers an anisotropic impact ionization process. This indicates that it is very important to consider anisotropic impact ionization in the design and characterization of 4H-SiC power devices
  • Keywords
    Monte Carlo methods; hydrogen; impact ionisation; numerical analysis; power semiconductor devices; semiconductor device breakdown; semiconductor device models; silicon compounds; 4H-SiC power semiconductor diodes; H-SiC; anisotropic breakdown simulation; anisotropic drift-diffusion model; breakdown characteristics of; characterization; design; device geometry; full band Monte Carlo simulations; hole impact ionization coefficients; numerical simulations; Anisotropic magnetoresistance; Argon; Breakdown voltage; Electric breakdown; Impact ionization; Medical simulation; Schottky diodes; Silicon carbide; Solid state circuits; Thermal conductivity;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Computers in Power Electronics, 2000. COMPEL 2000. The 7th Workshop on
  • Conference_Location
    Blacksburg, VA
  • Print_ISBN
    0-7803-6561-5
  • Type

    conf

  • DOI
    10.1109/CIPE.2000.904702
  • Filename
    904702