A price-performance model and parameter sensitivity analysis for semiconductor assembly equipment

A set of price-performance computer models, developed to analyze and evaluate semiconductor assembly equipment and operations, is presented. The set includes models for wafer preparation equipment, wafer dicing systems, die attach systems, and wire bonding systems. Variable parameters to be entered into the models are of three categories: (1) equipment performance data; (2) equipment maintenance data; and (3) economic data. For a given set of parameters, the models develop the assembly costs per thousand devices for each of two cases: (1) assembly costs less chip cost, and (2) assembly costs including yield loss cost. The parameters for a specific device, manufactured at a hypothetical assembly operation in Asia, are used for presentation purposes. The results produced by the models are discussed and analyzed. As an extension of the model, a sensitivity analysis of the wire bonding model is also presented. The specific and relative effects of variations in yield, footprint, mean time between assists, mean time between failures, and throughput on the cost per thousand devices assembled are examined