Title :
Speed, power and component density in multielement high-speed logic systems
Author_Institution :
Bell Telephone Laboratories, Murray Hill, NJ, USA
Keywords :
Computer networks; Impedance; Logic devices; Power transmission lines; Propagation delay; Switches; Temperature; Thermal conductivity; Thermal factors; Voltage;
Conference_Titel :
Solid-State Circuits Conference. Digest of Technical Papers. 1960 IEEE International
Conference_Location :
Philadelphia, PA, USA
DOI :
10.1109/ISSCC.1960.1157266
