DocumentCode :
28909
Title :
An Improved Dipole-Moment Model Based on Near-Field Scanning for Characterizing Near-Field Coupling and Far-Field Radiation From an IC
Author :
Zhenwei Yu ; Mix, Jason A. ; Sajuyigbe, Soji ; Slattery, Kevin P. ; Jun Fan
Author_Institution :
EMC Lab., Missouri Univ. of Sci. & Technol., Rolla, MO, USA
Volume :
55
Issue :
1
fYear :
2013
fDate :
Feb. 2013
Firstpage :
97
Lastpage :
108
Abstract :
In this paper, an improved dipole-moment model for characterizing near-field coupling and far-field radiation from an IC based on near-field scanning is proposed. An array of electric and magnetic dipole moments is used to reproduce the field distributions in a scanning plane above an IC. These dipole moments can then be used as noise sources for the IC. In order to ensure the accurate prediction of the near-field coupling from the IC, the regularization technique and the truncated singular-value decomposition method are investigated in this paper, together with the conventional least-squares method, to reconstruct the dipole moments from the near-field scanning data. A simple example is used to demonstrate the approach. The improved dipole-moment model is particularly useful for addressing radio-frequency interference issues where near-field noise coupling needs to be accurately analyzed.
Keywords :
radiofrequency integrated circuits; radiofrequency interference; singular value decomposition; IC; electric dipole moment array; far-field radiation characterization; improved dipole-moment model; least-squares method; magnetic dipole moment array; near-field coupling characterization; near-field noise coupling; near-field scanning data; radiofrequency interference issues; regularization technique; scanning plane; truncated singular-value decomposition method; Arrays; Couplings; Integrated circuit modeling; Magnetic moments; Mathematical model; Noise; Dipole-moment model; near-field coupling; near-field scanning; radio-frequency interference (RFI); regularization technique; truncated singular-value decomposition (SVD) method;
fLanguage :
English
Journal_Title :
Electromagnetic Compatibility, IEEE Transactions on
Publisher :
ieee
ISSN :
0018-9375
Type :
jour
DOI :
10.1109/TEMC.2012.2207726
Filename :
6256715
Link To Document :
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