Title :
Progress report on thin-film circuitry
Author_Institution :
IBM Corp., Kingston, NY, USA
Keywords :
Capacitors; Circuit stability; Electric shock; Fabrication; Humidity; Integrated circuit interconnections; Reproducibility of results; Resistors; Temperature; Thin film circuits;
Conference_Titel :
Solid-State Circuits Conference. Digest of Technical Papers. 1961 IEEE International
Conference_Location :
Philadelphia, PA, USA
DOI :
10.1109/ISSCC.1961.1157338