• DocumentCode
    2893199
  • Title

    A new thermal unit commitment approach using constraint logic programming

  • Author

    Huang, Kun-Yuan ; Yang, Hong-Tzer ; Huang, Ching-Lien

  • Author_Institution
    Dept. of Electr. Eng., Nat. Cheng Kung Univ., Tainan, Taiwan
  • fYear
    1997
  • fDate
    11-16 May 1997
  • Firstpage
    176
  • Lastpage
    185
  • Abstract
    The authors propose a constraint logic programming (CLP) algorithm to solve the thermal unit commitment (UC) problem in this paper. The algorithm combines the characteristics of the logic programming with the constraint satisfaction as well as the depth-first branch and bound (B&B) search techniques to provide an efficient and flexible approach to the UC problem. Through the constraint satisfaction techniques, the constraints, which consist of the upper bound on the objective value, are propagated as much as possible to actively reduce the search space of the UC problem in a priori way. Consequently, the optimal solution can be acquired in a very early stage. To demonstrate the effectiveness of the proposed approach, the practical thermal UC problem of Taiwan Power (Taipower) 38-unit system over a 24-hour period is solved by the CLP algorithm implemented in CHIP language, The results obtained are compared with those from the established methods of dynamic programming, Lagrangian relaxation as well as simulated annealing
  • Keywords
    constraint handling; load dispatching; load distribution; microcomputer applications; power station control; power station load; scheduling; thermal power stations; Lagrangian relaxation; Taiwan; algorithm; constraint logic programming; depth-first branch and bound search techniques; dynamic programming; objective value; simulated annealing; thermal unit commitment approach; Dynamic programming; IEEE members; Lagrangian functions; Load forecasting; Logic programming; Power generation economics; Simulated annealing; Thermal engineering; Thermal loading; Upper bound;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Power Industry Computer Applications., 1997. 20th International Conference on
  • Conference_Location
    Columbus, OH
  • Print_ISBN
    0-7803-3713-1
  • Type

    conf

  • DOI
    10.1109/PICA.1997.599394
  • Filename
    599394