Title :
Design and implementation of an IP wrapper for an on-chip network
Author :
Chi, Hsin-Chou ; Lin, Yu-Seng ; Wu, Chia-Ming
Keywords :
Chip scale packaging; Computer science; Electronic mail; Network topology; Network-on-a-chip; Next generation networking; Switches; System-on-a-chip; Tiles; Transistors;
Conference_Titel :
Circuits and Systems, 2004. Proceedings. The 2004 IEEE Asia-Pacific Conference on
Print_ISBN :
0-7803-8660-4
DOI :
10.1109/APCCAS.2004.1413059
