DocumentCode
2894256
Title
Design of a VIA based communication protocol for LAM/MPI suite
Author
Bertozzi, Massimo ; Panella, Marco ; Reggiani, Monica
Author_Institution
Dipt. di Ingegneria dell´´Inf., Parma Univ., Italy
fYear
2001
fDate
2001
Firstpage
27
Lastpage
33
Abstract
The increasing use of System Area Network (SAN) demands efficient communication to benefit SAN features through a direct access to network resources and avoiding kernel intervention in communication path. Recently, a consortium composed by Microsoft, Compaq and Intel authored a new standard, the Virtual Interface Architecture (VIA), designed to reduce software overhead in data transfers. This paper describes the communication protocol proposed in order to allow a complete implementation of MPI based on VIA. This protocol is needed because the plain use of the two VIA data transfer models does not allow the implementation of MPI based on VIA, due to the large number of MPI communication flavors. To validate the goodness of the proposed protocol, a new communication layer based on VIA has been introduced in the LAM/MPI suite. The reported results, referring to a software VIA implementation for fast Ethernet networks, exhibits a significant reduction in latency time of LAM/MPI based on VIA with respect to the same library based on the TCP/IP protocol
Keywords
application program interfaces; local area networks; performance evaluation; transport protocols; LAM/MPI suite; MPI communication flavors; TCP/IP protocol; VIA based communication protocol; Virtual Interface Architecture; communication path; data transfers; fast Ethernet networks; kernel intervention; latency time; network resources; software overhead; system area network; Access protocols; Computer architecture; Delay; Ethernet networks; Kernel; Software design; Software libraries; Software standards; Storage area networks; TCPIP;
fLanguage
English
Publisher
ieee
Conference_Titel
Parallel and Distributed Processing, 2001. Proceedings. Ninth Euromicro Workshop on
Conference_Location
Mantova
Print_ISBN
0-7695-0987-8
Type
conf
DOI
10.1109/EMPDP.2001.904967
Filename
904967
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