Title :
A 3.9ns 8.9mW 4×4 silicon photonic switch hybrid integrated with CMOS driver
Author :
Rylyakov, Alexander ; Schow, Clint ; Lee, Benjamin ; Green, William ; Van Campenhout, Joris ; Yang, Min ; Doany, Fuad ; Assefa, Solomon ; Jahnes, Christopher ; Kash, Jeffrey ; Vlasov, Yurii
Author_Institution :
IBM T. J. Watson Reseach Center, Yorktown Heights, NY, USA
Abstract :
The emerging field of silicon photonics targets monolithic integration of optical components in the CMOS process, potentially enabling high bandwidth, high density interconnects with dramatically reduced cost and power dissipation. A broadband photonic switch is a key component of reconfigurable networks which retain data in the optical domain, thus bypassing the latency, bandwidth and power overheads of opto-electronic conversion. Additionally, with WDM channels, multiple data streams can be routed simultaneously using a single optical device. Although many types of discrete silicon photonic switches have been reported, very few of them have been shown to operate with CMOS drivers. Earlier, we have reported two different 2×2 optical switches wirebond packaged with 90nm CMOS drivers. The 2×2 switch reported in is based on a Mach-Zehnder interferometer (MZI), while the one reported in is based on a two-ring resonator.
Keywords :
CMOS integrated circuits; Mach-Zehnder interferometers; driver circuits; elemental semiconductors; integrated optoelectronics; optical resonators; photonic switching systems; silicon; wavelength division multiplexing; CMOS driver; Mach-Zehnder interferometer; Si; WDM channels; broadband photonic switch; high density interconnects; monolithic integration; multiple data streams; optical components; optical device; optical domain; optical switches; opto-electronic conversion; power 8.9 mW; power dissipation; reconfigurable networks; silicon photonic switch; size 90 nm; time 3.9 ns; two-ring resonator; wirebond package; CMOS integrated circuits; Driver circuits; Optical ring resonators; Optical switches; Photonics; Routing;
Conference_Titel :
Solid-State Circuits Conference Digest of Technical Papers (ISSCC), 2011 IEEE International
Conference_Location :
San Francisco, CA
Print_ISBN :
978-1-61284-303-2
DOI :
10.1109/ISSCC.2011.5746293