Title :
New features from non-soldered clamp-mounted diode laser bars
Author :
Viera, Gregorio ; Galan, Miguel ; Isern, Albert ; Zsolochevsca, Oksana ; Leyva, Antonio ; Etzkorn, Thomas
Author_Institution :
MONOCROM, Vilanova i la Geltru, Spain
Abstract :
High-power diode lasers are conventionally mounted using a soldering process. This process reduces the beam quality and also reliability of the device. To overcome this problem, a new technology called laser bar clamping technology is introduced in this paper. In this technology the bars are clamped between two electrodes and fixed using mechanical pressure.
Keywords :
laser beams; semiconductor device packaging; semiconductor device reliability; semiconductor lasers; high-power diode lasers; laser bar clamping technology; laser beam quality; laser reliability; mechanical pressure; Bars; Copper; Diode lasers; Electrodes; Optical pulses; Power lasers; Soldering; Thermal conductivity; Thermal resistance; Thermal stresses;
Conference_Titel :
Lasers and Electro-Optics Europe, 2005. CLEO/Europe. 2005 Conference on
Print_ISBN :
0-7803-8974-3
DOI :
10.1109/CLEOE.2005.1567895
