Title :
Systematic procedures for digital system realization from logic design to production
Author_Institution :
Fairchild Semiconductor, Palo Alto, CA, USA
Keywords :
Circuit testing; Digital systems; Electronics industry; Electronics packaging; Integrated circuit packaging; Logic design; Production systems; Semiconductor device packaging; Soldering; Transmission line matrix methods;
Conference_Titel :
Solid-State Circuits Conference. Digest of Technical Papers. 1964 IEEE International
Conference_Location :
Philadelphia, PA, USA
DOI :
10.1109/ISSCC.1964.1157519
