• DocumentCode
    2895569
  • Title

    Heat Transfer from the Packaging Structure to the Coolers using Natural Circulation

  • Author

    Vesterberg, Hans

  • Author_Institution
    Ericsson Power Systems, RIFR AB, S-163 81 Stockholm, SWEDEN
  • fYear
    1987
  • fDate
    14-17 June 1987
  • Firstpage
    551
  • Lastpage
    556
  • Abstract
    A calculation model for heat transfer by natural convection from vertical parallel plates with chimney is presented. Results from applications on circuit boards as well as a plate fin cooler are presented. The model is also used for calculations on the circutation from the circuit boards to the cooler.
  • Keywords
    Electronic equipment; Electronics cooling; Equations; Heat transfer; Heating; Packaging; Power system modeling; Printed circuits; Temperature; UHF circuits;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Telecommunications Energy Conference, 1987. INTELEC '87. The Ninth International
  • Conference_Location
    Stockholm, Sweden
  • Print_ISBN
    91-7810-916-7
  • Type

    conf

  • DOI
    10.1109/INTLEC.1987.4794614
  • Filename
    4794614
    • Link To Document
    https://search.isc.ac/dl/search/defaultta.aspx?DTC=49&DC=2895569