Title :
Heat Transfer from the Packaging Structure to the Coolers using Natural Circulation
Author :
Vesterberg, Hans
Author_Institution :
Ericsson Power Systems, RIFR AB, S-163 81 Stockholm, SWEDEN
Abstract :
A calculation model for heat transfer by natural convection from vertical parallel plates with chimney is presented. Results from applications on circuit boards as well as a plate fin cooler are presented. The model is also used for calculations on the circutation from the circuit boards to the cooler.
Keywords :
Electronic equipment; Electronics cooling; Equations; Heat transfer; Heating; Packaging; Power system modeling; Printed circuits; Temperature; UHF circuits;
Conference_Titel :
Telecommunications Energy Conference, 1987. INTELEC '87. The Ninth International
Conference_Location :
Stockholm, Sweden
Print_ISBN :
91-7810-916-7
DOI :
10.1109/INTLEC.1987.4794614
