DocumentCode :
2895860
Title :
Tip-chip Bonding: Solder Bond Assembly To Ends Of Waveguides
Author :
Chan, Winston K. ; Yi-Yan, Alfredo ; Bhat, Rajaram
Author_Institution :
Bellcore
fYear :
1993
fDate :
34054
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Sarnoff Symposium, 1993 IEEE Princeton Section
Type :
conf
DOI :
10.1109/SARNOF.1993.657955
Filename :
657955
Link To Document :
https://search.ricest.ac.ir/dl/search/defaultta.aspx?DTC=49&DC=2895860
