Title :
An ultra-miniature camera and processing system
Author :
Larcombe, S.P. ; Stern, J.M. ; Ivey, P.A. ; Seed, N.L.
Author_Institution :
Dept. of Electron. & Electr. Eng., Sheffield Univ., UK
Abstract :
The following paper describes a single module which integrates an image sensor and programmable processing resources. The completed module has dimensions of 20.6(w)×15.75(d)×14.7(h) mm, giving an overall volume of 4.75 ml (0.3 cubic inches). This is achieved using a novel three-dimensional packaging technology, referred to as MCM-V (multichip module-vertical). We have demonstrated that this technique can be applied to produce high-density systems incorporating sensors, processing and support circuitry. The technology, system architecture and applications are discussed
Keywords :
cameras; image processing equipment; image sensors; 14.7 mm; 15.75 mm; 20.6 mm; MCM-V; high-density systems; image sensor; multichip module-vertical packaging; programmable processing resources; three-dimensional packaging technology; ultra-miniature camera;
Conference_Titel :
Integrated Imaging Sensors and Processing, IEE Colloquium on
Conference_Location :
London
