• DocumentCode
    2896295
  • Title

    Variation-Aware Scheduling for Chip Multiprocessors with Thread Level Redundancy

  • Author

    Dong, Jianbo ; Zhang, Lei ; Han, Yinhe ; Yan, Guihai ; Li, Xiaowei

  • Author_Institution
    Key Lab. of Comput. Syst., Chinese Acad. of Sci., Beijing, China
  • fYear
    2009
  • fDate
    16-18 Nov. 2009
  • Firstpage
    17
  • Lastpage
    22
  • Abstract
    Thread-level redundancy in Chip Multiprocessors(TLR-CMP) is efficient for soft error tolerance. Process variation causes core-to-core (C2C) performance asymmetry across a chip, which should be taken into consideration for application scheduling. In this paper, two types of variations beyond C2C are introduced, i.e., inter-pair and intra-pair variation in TLR-CMP. Intra-pair performance asymmetry can affect the performance of applications differently. Based on the above observation, we firstly formalize the variation aware scheduling in TLR-CMP as a 0-1 programming problem,to maximize the system weighted throughput. An efficient scheduling algorithm, named IntraVarF&AppSen, is then proposed to tackle this problem, which can be proved to be optimal when the number of applications to be scheduled is equal to the number of core pairs. Simulation on a 64-core CMP shows 2.8%-4% improvement in weighted throughput when compared to prior VarF&AppIPC algorithm.
  • Keywords
    processor scheduling; 0-1 programming problem; IntraVarF&AppSen; chip multiprocessors; core-to-core performance asymmetry; interpair performance asymmetry; intra-pair performance asymmetry; soft error tolerance; thread level redundancy; variation-aware scheduling; Cathode ray tubes; Computer architecture; Error analysis; Job shop scheduling; Multiprocessing systems; Redundancy; Scheduling algorithm; Throughput; Transistors; Yarn; chip multiprocessor; process variation; scheduling; thread-level redundancy;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Dependable Computing, 2009. PRDC '09. 15th IEEE Pacific Rim International Symposium on
  • Conference_Location
    Shanghai
  • Print_ISBN
    978-0-7695-3849-5
  • Type

    conf

  • DOI
    10.1109/PRDC.2009.12
  • Filename
    5368232