• DocumentCode
    2896342
  • Title

    Exploring compact design on high throughput coarse grained reconfigurable architectures

  • Author

    Tanigawa, Kazuya ; Zuyama, Tetsuya ; Uchida, Takuro ; Hironaka, Tetsuo

  • Author_Institution
    Grad. Sch. of Inf. Sci., Hiroshima City Univ., Hiroshima
  • fYear
    2008
  • fDate
    8-10 Sept. 2008
  • Firstpage
    543
  • Lastpage
    546
  • Abstract
    Aiming toward a compact high- throughput reconfigurable architecture, we propose the reconfigurable processor DS-HIE. In order to achieve the characteristics of compactness and high-throughput, the DS-HIE architecture executes operations following a bit-serial computation scheme and adopts a Benes network as its routing resource. Implementing bit-serial computation brings the advantage of small chip area and high throughput to the DS-HIE architecture, and the Benes network ensures the high availability of the routing paths within a compact chip area. In this paper, we explain several methods, namely two data transfer methods and three feedback path methods, and provide an evaluation of the architecture. The evaluation results showed that the structure which allows for the smallest chip area comprises the dedicated wiring method for data transfer and the area effort method for routing. Further, the transistor count of the DS-HIE processor is notably smaller than that of the core 2 duo processor.
  • Keywords
    digital signal processing chips; reconfigurable architectures; bit-serial computation scheme; data transfer methods; feedback path methods; high throughput coarse grained reconfigurable architectures; reconfigurable processor; routing paths; routing resource; Availability; Computer architecture; Computer networks; Hardware; Pipelines; Reconfigurable architectures; Reduced instruction set computing; Routing; Signal processing; Throughput;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Field Programmable Logic and Applications, 2008. FPL 2008. International Conference on
  • Conference_Location
    Heidelberg
  • Print_ISBN
    978-1-4244-1960-9
  • Electronic_ISBN
    978-1-4244-1961-6
  • Type

    conf

  • DOI
    10.1109/FPL.2008.4630004
  • Filename
    4630004