• DocumentCode
    289636
  • Title

    The use of lasers for the soldering of high density interconnects

  • Author

    Beckett, P.M. ; Fleming, A.R. ; Foster, R.J. ; Gilbert, J.M. ; Whitehead, D.G.

  • Author_Institution
    Hull Univ., UK
  • fYear
    1994
  • fDate
    34655
  • Firstpage
    42461
  • Lastpage
    42464
  • Abstract
    Lasers play an increasingly important role in materials processing, typically in hole drilling, cutting, welding and heat treatment. In this paper we present a further application for lasers in manufacturing and assembly-that of the soldering of electronic components
  • Keywords
    assembling; fine-pitch technology; laser beam applications; printed circuit manufacture; soldering; PCBs; assembly; electronic components; fine pitch; high density interconnects; laser soldering; materials processing;
  • fLanguage
    English
  • Publisher
    iet
  • Conference_Titel
    Interconnection Technology (Digest No.1994/220), IEE Colloquium on
  • Conference_Location
    London
  • Type

    conf

  • Filename
    383875
    • Link To Document
    https://search.isc.ac/dl/search/defaultta.aspx?DTC=49&DC=289636