DocumentCode
289640
Title
IEE Colloquium on `Interconnection Technology´ (Digest No.1994/220)
fYear
1994
fDate
34655
Abstract
The following topics were dealt with: organic substrates; conducting adhesives for HDI; inert gas wave soldering; laser soldering of high density interconnects; optical interconnect for modular avionics; compact high bit rate modules for intra bond optical interconnects; and Si hybrid integrated fibre optic transmitter
Keywords
integrated circuit interconnections; modules; optical interconnections; packaging; soldering; substrates; HDI; Si hybrid integrated fibre optic transmitter; conducting adhesives; high bit rate modules; high density interconnects; inert gas wave soldering; laser soldering; modular avionics; optical interconnect; organic substrates; packaging;
fLanguage
English
Publisher
iet
Conference_Titel
Interconnection Technology (Digest No.1994/220), IEE Colloquium on
Conference_Location
London
Type
conf
Filename
383879
Link To Document