Title :
IEE Colloquium on `Interconnection Technology´ (Digest No.1994/220)
Abstract :
The following topics were dealt with: organic substrates; conducting adhesives for HDI; inert gas wave soldering; laser soldering of high density interconnects; optical interconnect for modular avionics; compact high bit rate modules for intra bond optical interconnects; and Si hybrid integrated fibre optic transmitter
Keywords :
integrated circuit interconnections; modules; optical interconnections; packaging; soldering; substrates; HDI; Si hybrid integrated fibre optic transmitter; conducting adhesives; high bit rate modules; high density interconnects; inert gas wave soldering; laser soldering; modular avionics; optical interconnect; organic substrates; packaging;
Conference_Titel :
Interconnection Technology (Digest No.1994/220), IEE Colloquium on
Conference_Location :
London
