• DocumentCode
    2896466
  • Title

    Electromagnetic Compatibility Modeling in Low-Noise Medical Sensor Interfaces

  • Author

    Valorge, Olivier ; Gosselin, Benoit ; Tanguay, Louis-François ; Sawan, Mohamad

  • Author_Institution
    Dept. of Electr. Eng., Ecole Polytechnique de Montreal, Que.
  • fYear
    2007
  • fDate
    27-30 May 2007
  • Firstpage
    1545
  • Lastpage
    1548
  • Abstract
    Investigations on the electromagnetic behaviour of a low-power amplifier are led using the extended-integrated circuit emission model (ICEM). This modeling approach is proposed on a mixed-signal (analog/digital) CMOS 0.18 mum circuit dedicated to neural signal recording. This ICEM allows coarse and fast studies of the electromagnetic compatibility of CMOS devices especially in characterizing the coupling phenomena that occurs at each building block inside the whole chip. ICEM simulations of power and ground bounces are more than 500 times faster than complete SPICE ones with a correct accuracy for first electromagnetic compatibility investigations. This quick modeling method allows for checking many different design or simulation configurations. For example, some simulation results show that substrate interactions and power/ground crosstalk increase the noise level of the low-noise amplifier, in particular in its low frequency domain.
  • Keywords
    CMOS integrated circuits; amplifiers; bioelectric potentials; biomedical electronics; electromagnetic compatibility; low-power electronics; mixed analogue-digital integrated circuits; sensors; 0.18 micron; CMOS devices; SPICE; analog CMOS circuit; bioamplifier; digital CMOS circuit; electromagnetic behaviour; electromagnetic compatibility modeling; extended-integrated circuit emission model; ground crosstalk; low-noise medical sensor interfaces; low-power amplifier; mixed-signal CMOS circuit; neural signal recording; power crosstalk; quick modeling method; substrate interactions; substrate noise; CMOS analog integrated circuits; CMOS digital integrated circuits; Circuit simulation; Coupling circuits; Digital recording; Electromagnetic compatibility; Electromagnetic coupling; Electromagnetic modeling; SPICE; Semiconductor device modeling; Electromagnetic compatibility; ICEM; bioamplifier; power/ground noise; substrate noise;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Circuits and Systems, 2007. ISCAS 2007. IEEE International Symposium on
  • Conference_Location
    New Orleans, LA
  • Print_ISBN
    1-4244-0920-9
  • Electronic_ISBN
    1-4244-0921-7
  • Type

    conf

  • DOI
    10.1109/ISCAS.2007.378706
  • Filename
    4252946