Title :
Cluster architecture based on low cost reconfigurable hardware
Author :
Pedraza, Cesar ; Castillo, E. ; Castillo, Emilio ; Camarero, Cristobal ; Bosque, José L. ; Martínez, José I. ; Menendez, Rafael
Author_Institution :
Escuela Tec. Super. de Ing. Inf., Univ. Rey Juan Carlos, Madrid
Abstract :
The SMILE project accelerates scientific and industrial applications by means of a cluster of low-cost FPGA boards. With this approach the intensive calculation tasks are accelerated using the FPGA logic, while the communication patterns of the applications remains unchanged by using a Message Passing Library over Linux. This paper explains the cluster architecture: the SMILE nodes and the developed high-speed communication network for the FPGA RocketIO interfaces. A SystemC model developed to simulate the cluster is also detailed. In order to show the potential of the SMILE proposal a Content-Based Information Retrieval parallel application has been developed and compared with a HP cluster architecture in terms of response time andpower consumption.
Keywords :
Linux; content-based retrieval; field programmable gate arrays; message passing; multiprocessing systems; parallel processing; FPGA RocketIO interfaces; FPGA logic; HP cluster architecture comparison; Linux; SMILE cluster architecture; SMILE nodes; SMILE project; SystemC model; communication patterns; content-based information retrieval parallel application; high-speed communication network; industrial applications; low-cost FPGA boards; message passing library; power consumption; response time; scientific applications; scientific parallel multiprocessing based-on-low cost reconfigurable hardware; Acceleration; Communication networks; Costs; Field programmable gate arrays; Hardware; Libraries; Linux; Message passing; Proposals; Reconfigurable logic;
Conference_Titel :
Field Programmable Logic and Applications, 2008. FPL 2008. International Conference on
Conference_Location :
Heidelberg
Print_ISBN :
978-1-4244-1960-9
Electronic_ISBN :
978-1-4244-1961-6
DOI :
10.1109/FPL.2008.4630017