DocumentCode :
2896864
Title :
Integrated EM & thermal simulation with VORPAL software
Author :
Smithe, David ; Crockett, Robert ; Wang, Haipeng ; Cheng, Gary
Author_Institution :
Tech-X Corp., Boulder, CO, USA
fYear :
2012
fDate :
24-26 April 2012
Firstpage :
27
Lastpage :
28
Abstract :
The VORPAL finite-difference time-domain particle-in-cell simulation tool now has thermal solver capability, which we are using to model transmission lines and accelerating cavities of cryogenic SRF accelerators. This same capability can be brought to bear on room temperature problems EM and Thermal physics. Our thermal solver treats the non-linear evolution of the material properties, such as electrical and thermal conductivity. We have recently upgraded our thermal solver to allow for implicit solves with larger time-steps, consistent with problems having material interfaces with drastically different (~105) thermal conductivities. We present benchmarks of integrated problems including a coaxial feed-through into a high-order mode coupler, and time-domain modeling of cryogenic quench events.
Keywords :
coaxial waveguides; cryogenic electronics; electrical conductivity; electromagnetic field theory; finite difference time-domain analysis; thermal conductivity; transmission lines; VORPAL software; accelerating cavities; coaxial feed-through; cryogenic SRF accelerators; cryogenic quench events; electrical conductivity; finite-difference time-domain simulation; high-order mode coupler; integrated EM simulation; material properties; nonlinear evolution; particle-in-cell simulation; thermal conductivity; thermal physics; thermal simulation; thermal solver; time-domain modeling; transmission lines; Benchmark testing; Electromagnetics; Geometry; Materials; Software; Solid modeling; Thermal conductivity; VORPAL; cryogenic; cut-cell boundaries; electromagnetic analysis; finite-difference; integrated software; multiple effects; thermal analysis;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Vacuum Electronics Conference (IVEC), 2012 IEEE Thirteenth International
Conference_Location :
Monterey, CA
Print_ISBN :
978-1-4673-0188-6
Electronic_ISBN :
978-1-4673-0187-9
Type :
conf
DOI :
10.1109/IVEC.2012.6262060
Filename :
6262060
Link To Document :
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