Title :
A 100 mW, 0.670 THz power module
Author :
Tucek, Jack C. ; Basten, Mark A. ; Gallagher, David A. ; Kreischer, Kenneth E. ; Lai, Richard ; Radisic, Vesna ; Leong, Kevin ; Mihailovich, Robert
Author_Institution :
Electron. Syst., Northrop Grumman Corp., Rolling Meadows, IL, USA
Abstract :
A 0.670 THz Power Module based on a vacuum electronic (VE) power amplifier and a solid-state power amplifier (SSPA) has produced >;100 mW, operating from 0.640-0.685 THz in a bread-board demonstration. The driver amplifier is a power-combined, MMIC SSPA module based on InP HEMT technology. The compact VE power amplifier is based on a DRIE-fabricated folded waveguide slow-wave circuit, together with a high current density thermionic cathode and a single-stage, depressed collector for increased overall device efficiency. The VE power amplifier achieved 21.5 dB of gain, 15 GHz of operational bandwidth, a collector efficiency of 93% and an overall device efficiency of 0.44%.
Keywords :
III-V semiconductors; MMIC power amplifiers; current density; driver circuits; high electron mobility transistors; indium compounds; modules; power combiners; slow wave structures; sputter etching; submillimetre wave devices; terahertz wave devices; DRIE-fabrication; HEMT technology; InP; SSPA; VE power amplifier; bread-board demonstration; current density; device efficiency; driver amplifier; efficiency 0.44 percent; efficiency 93 percent; folded waveguide slow-wave circuit; frequency 0.640 THz to 0.685 THz; frequency 15 GHz; gain 21.5 dB; power 100 mW; power module; power-combined MMIC SSPA module; single-stage depressed collector; solid-state power amplifier; thermionic cathode; vacuum electronic power amplifier; Cathodes; Electron beams; Multichip modules; Optical waveguides; Power amplifiers; Power generation; Radio frequency; Terahertz; high-resolution imaging; submillimeter wave; vacuum electronics;
Conference_Titel :
Vacuum Electronics Conference (IVEC), 2012 IEEE Thirteenth International
Conference_Location :
Monterey, CA
Print_ISBN :
978-1-4673-0188-6
Electronic_ISBN :
978-1-4673-0187-9
DOI :
10.1109/IVEC.2012.6262062
