• DocumentCode
    2897027
  • Title

    F5: Image sensors for 3D capture

  • Author

    Solhusvik, J. ; Theuwissen, A. ; Kavusi, S. ; Nomoto, T. ; Chen, I-Chieh

  • Author_Institution
    Aptina, Oslo, Norway
  • fYear
    2011
  • fDate
    20-24 Feb. 2011
  • Firstpage
    520
  • Lastpage
    521
  • Abstract
    Low-cost 3D image capture is a popular R&D topic these days driven by a rapid growth in 3D viewing applications such as gaming and 3D movies. This forum commences with an overview of 3D display technologies and applications. It is followed by a 3D capture technology overview, how each method compares in performance, and its key design challenges to be successful in cost driven consumer and industrial applications. World experts on image sensor design will present pixel architectures, devices, circuits and technologies used to build 3D imager chips. Time-of-flight, stereo vision, structured light and multi-aperture imaging will be covered. The forum concludes with a panel discussion providing the opportunity for participants to give feedback and ask questions. The forum is aimed at circuit designers and engineers working in the imaging industry.
  • Keywords
    image sensors; three-dimensional displays; 3D capture technology; 3D display technologies; 3D imager chips; 3D movies; 3D viewing applications; gaming; image sensor design; image sensors; multiaperture imaging; pixel architectures; stereo vision; structured light imaging; time-of-flight; CMOS integrated circuits; Electrical engineering; Image sensors; Patents; Sensors; Three dimensional displays;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Solid-State Circuits Conference Digest of Technical Papers (ISSCC), 2011 IEEE International
  • Conference_Location
    San Francisco, CA
  • ISSN
    0193-6530
  • Print_ISBN
    978-1-61284-303-2
  • Type

    conf

  • DOI
    10.1109/ISSCC.2011.5746432
  • Filename
    5746432