DocumentCode :
2897027
Title :
F5: Image sensors for 3D capture
Author :
Solhusvik, J. ; Theuwissen, A. ; Kavusi, S. ; Nomoto, T. ; Chen, I-Chieh
Author_Institution :
Aptina, Oslo, Norway
fYear :
2011
fDate :
20-24 Feb. 2011
Firstpage :
520
Lastpage :
521
Abstract :
Low-cost 3D image capture is a popular R&D topic these days driven by a rapid growth in 3D viewing applications such as gaming and 3D movies. This forum commences with an overview of 3D display technologies and applications. It is followed by a 3D capture technology overview, how each method compares in performance, and its key design challenges to be successful in cost driven consumer and industrial applications. World experts on image sensor design will present pixel architectures, devices, circuits and technologies used to build 3D imager chips. Time-of-flight, stereo vision, structured light and multi-aperture imaging will be covered. The forum concludes with a panel discussion providing the opportunity for participants to give feedback and ask questions. The forum is aimed at circuit designers and engineers working in the imaging industry.
Keywords :
image sensors; three-dimensional displays; 3D capture technology; 3D display technologies; 3D imager chips; 3D movies; 3D viewing applications; gaming; image sensor design; image sensors; multiaperture imaging; pixel architectures; stereo vision; structured light imaging; time-of-flight; CMOS integrated circuits; Electrical engineering; Image sensors; Patents; Sensors; Three dimensional displays;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Solid-State Circuits Conference Digest of Technical Papers (ISSCC), 2011 IEEE International
Conference_Location :
San Francisco, CA
ISSN :
0193-6530
Print_ISBN :
978-1-61284-303-2
Type :
conf
DOI :
10.1109/ISSCC.2011.5746432
Filename :
5746432
Link To Document :
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