DocumentCode
2897027
Title
F5: Image sensors for 3D capture
Author
Solhusvik, J. ; Theuwissen, A. ; Kavusi, S. ; Nomoto, T. ; Chen, I-Chieh
Author_Institution
Aptina, Oslo, Norway
fYear
2011
fDate
20-24 Feb. 2011
Firstpage
520
Lastpage
521
Abstract
Low-cost 3D image capture is a popular R&D topic these days driven by a rapid growth in 3D viewing applications such as gaming and 3D movies. This forum commences with an overview of 3D display technologies and applications. It is followed by a 3D capture technology overview, how each method compares in performance, and its key design challenges to be successful in cost driven consumer and industrial applications. World experts on image sensor design will present pixel architectures, devices, circuits and technologies used to build 3D imager chips. Time-of-flight, stereo vision, structured light and multi-aperture imaging will be covered. The forum concludes with a panel discussion providing the opportunity for participants to give feedback and ask questions. The forum is aimed at circuit designers and engineers working in the imaging industry.
Keywords
image sensors; three-dimensional displays; 3D capture technology; 3D display technologies; 3D imager chips; 3D movies; 3D viewing applications; gaming; image sensor design; image sensors; multiaperture imaging; pixel architectures; stereo vision; structured light imaging; time-of-flight; CMOS integrated circuits; Electrical engineering; Image sensors; Patents; Sensors; Three dimensional displays;
fLanguage
English
Publisher
ieee
Conference_Titel
Solid-State Circuits Conference Digest of Technical Papers (ISSCC), 2011 IEEE International
Conference_Location
San Francisco, CA
ISSN
0193-6530
Print_ISBN
978-1-61284-303-2
Type
conf
DOI
10.1109/ISSCC.2011.5746432
Filename
5746432
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