Title :
FPGA interconnect sizing using extended logical effort model
Author_Institution :
Dept. of Comput. Sci. & Eng., Chinese Univ. of Hong Kong, Hong Kong
Abstract :
The proposed XLE model will enable us to calculate the delay of FPGA interconnect and determine closed form expressions for optimal transistor size, sensitivity and a minimal bound on delay. We will further extend it to cover process variations, resulting in a tool that can compare the statistical properties of different architectures. The models are simple and relatively technology independent and hence can be used to gain better intuition into the major causes of delay. Such a delay model can be used in optimization models and CAD tools as well as aid designers in developing new FPGA interconnect schemes.
Keywords :
CAD; field programmable gate arrays; integrated circuit interconnections; logic design; CAD tools; FPGA interconnect; XLE model; closed form expressions; optimization models; Circuit simulation; Delay; Design optimization; Driver circuits; Field programmable gate arrays; Integrated circuit interconnections; Inverters; Semiconductor device modeling; Statistical analysis; Threshold voltage;
Conference_Titel :
Field Programmable Logic and Applications, 2008. FPL 2008. International Conference on
Conference_Location :
Heidelberg
Print_ISBN :
978-1-4244-1960-9
Electronic_ISBN :
978-1-4244-1961-6
DOI :
10.1109/FPL.2008.4630042