Title :
Session 8 overview / wireline: Architectures & circuits for next generation wireline transceivers
Author :
Friedman, Daniel ; Yamaguchi, Koichi
Author_Institution :
IBM T. J. Watson Research Center, Yorktown Heights, NY
Abstract :
Summary form only given. Meeting the challenges for next generation communication systems demands a combination of circuit and architecture innovation. Circuit innovation, by extending the performance achievable using CMOS technologies, yields increasingly flexible standard-compliant designs, allows data rates to be pushed to new levels, and enables the creation of new ways to mitigate deep submicron technology constraints. Architecture innovation will have longer-term impact in areas ranging from addressing serial link power challenges to creating entirely new serial link application spaces.
Conference_Titel :
Solid-State Circuits Conference Digest of Technical Papers (ISSCC), 2011 IEEE International
Conference_Location :
San Francisco, CA
Print_ISBN :
978-1-61284-303-2
DOI :
10.1109/ISSCC.2011.5746441