Thermal analysis of an S-band output RF vacuum window

Author

Dai, Shun ; Zhu, Fang

Author_Institution

Nat. Astron. Obs., Beijing, China

fYear

2012

fDate

24-26 April 2012

Firstpage

77

Lastpage

78

Abstract

The RF loss power of a dielectric disk for an Sband output vacuum window is calculated in terms of the transmissions of the cylindrical-waveguide TE₁₁-mode together with the cylindrical-waveguide TM₁₁-mode. The warm-up process of the window due to the RF loss is simulated using ANSYS code. The temperature distribution and the thermal stress pattern of the window structure are also obtained. The results show that, the maximal temperature gradient of the window disk may exceed its heat-resistant limit, which increase the possibility of window cracking.

Keywords

circular waveguides; temperature distribution; thermal analysis; thermal stresses; vacuum tubes; ANSYS code; RF loss power; S-band output RF vacuum window; cylindrical-waveguide TE₁₁-mode; dielectric disk; high-power microwave tubes; maximal temperature gradient; temperature distribution; thermal analysis; thermal stress; window cracking; Dielectric losses; Radio frequency; Stress; Temperature distribution; Thermal analysis; Thermal stresses; Output window; RF dielectric loss; Thermal analysis; Thermal stress;

fLanguage

English

Publisher

ieee

Conference_Titel

Vacuum Electronics Conference (IVEC), 2012 IEEE Thirteenth International

Conference_Location

Monterey, CA

Print_ISBN

978-1-4673-0188-6

Electronic_ISBN

978-1-4673-0187-9

Type

conf

DOI

10.1109/IVEC.2012.6262081

Filename

6262081