Title :
Analysis and solutions to issue queue process variation
Author :
Soundararajan, Niranjan ; Yanamandra, Aditya ; Nicopoulos, Chrysostomos ; Vijaykrishnan, N. ; Sivasubramaniam, Anand ; Irwin, Mary Jane
Author_Institution :
Dept. of Comput. Sci. & Eng., Pennsylvania State Univ., University Park, PA
Abstract :
The last few years have witnessed an unprecedented explosion in transistor densities. Diminutive feature sizes have enabled microprocessor designers to break the billion-transistors per chip mark. However various new reliability challenges such as process variation (PV) have emerged that can no longer be ignored by chip designers. In this paper, we provide a comprehensive analysis of the effects of PV on the microprocessorpsilas Issue Queue. Variations can slow down issue queue entries and result in as much as 20.5% performance degradation. To counter this, we look at different solutions that include instruction steering, operand- and port- switching mechanisms. Given that PV is non-deterministic at design-time, our mechanisms allow the fast and slow issue-queue entries to co-exist in turn enabling instruction dispatch, issue and forwarding to proceed with minimal stalls. Evaluation on a detailed simulation environment indicates that the proposed mechanisms can reduce performance degradation due to PV to a low 1.3%.
Keywords :
integrated circuit design; microprocessor chips; network analysis; billion-transistors per chip; diminutive feature sizes; instruction steering; issue queue; operand-switching mechanism; port-switching mechanism; queue process variation; transistor densities; turn enabling instruction dispatch; Acoustical engineering; Circuit synthesis; Computer science; Counting circuits; Degradation; Manufacturing; Microprocessors; Modems; Queueing analysis; System performance; IPC; Issue Queue; Microarchitecture; Pipeline; Process Variation;
Conference_Titel :
Dependable Systems and Networks With FTCS and DCC, 2008. DSN 2008. IEEE International Conference on
Conference_Location :
Anchorage, AK
Print_ISBN :
978-1-4244-2397-2
Electronic_ISBN :
978-1-4244-2398-9
DOI :
10.1109/DSN.2008.4630066