Title :
The case for hybrid circuits
Author_Institution :
IBM Corp., Poughkeepsie, NY, USA
Keywords :
Diodes; Hybrid integrated circuits; Integrated circuit manufacture; Integrated circuit technology; Monolithic integrated circuits; Passive networks; Silicon; Thick film circuits; Thick films; Thin film circuits;
Conference_Titel :
Solid-State Circuits Conference. Digest of Technical Papers. 1965 IEEE International
Conference_Location :
Philadelphia, PA, USA
DOI :
10.1109/ISSCC.1965.1157640