• DocumentCode
    2897849
  • Title

    Reference architecture for 3G thin client multimodal applications

  • Author

    Pavlovski, Christopher J. ; Wood, David ; Mitchell, Stella ; Jones, David

  • Author_Institution
    IBM Thomas J. Watson Res. Center, Hawthorne, NY, USA
  • Volume
    2
  • fYear
    2004
  • fDate
    26-29 Oct. 2004
  • Firstpage
    1192
  • Abstract
    As 3G mobile networks emerge, they offer the potential to develop new and enhanced services that have been previously impractical over 2G networks. Many of these value added services focus on the higher data rates supported by 3G. An additional capability of 3G networks is the multicall supplementary service, which enables the transmission of both voice and data simultaneously. This capability can be leveraged to provide a multimodal user interface. We propose a browser (thin) client reference architecture for supporting a conversational multimodal application. We observe that such an architecture possesses several additional challenges when compared to a thick client application approach. We demonstrate the feasibility of our architecture with our prototype results, and devise a reference architecture for commercial implementations that enables users to interact with applications using simultaneous voice and data over 3G networks, without the restriction of software deployed to the device.
  • Keywords
    3G mobile communication; integrated voice/data communication; natural language interfaces; network computers; telecommunication computing; 3G mobile networks; 3G thin client; browser reference architecture; data rates; multicall supplementary service; multimodal user interface; reference architecture; voice data transmission; Application software; Computer architecture; Electronic mail; Natural languages; Navigation; Packet switching; Software prototyping; Switches; Switching circuits; User interfaces;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Communications and Information Technology, 2004. ISCIT 2004. IEEE International Symposium on
  • Print_ISBN
    0-7803-8593-4
  • Type

    conf

  • DOI
    10.1109/ISCIT.2004.1413907
  • Filename
    1413907