DocumentCode

2897923

Title

Building-in Reliability at SGC-THOMSON Microelectronics

Author

Hoang, Hoang Huy

Author_Institution

Process Reliability Engineering

fYear

1992

fDate

25-28 Oct. 1992

Firstpage

44

Lastpage

53

Keywords

Microelectronics; Production; Reliability engineering;

fLanguage

English

Publisher

ieee

Conference_Titel

Wafer Level Reliability Workshop, 1992. Final Report., 1992 International

Conference_Location

Lake Tahoe, CA, USA

Type

conf

DOI

10.1109/IWLR.1992.657983

Filename

657983