Title :
3DFlex: A flexible system for total visual inspection of bumped devices
Author :
De Meneses, Yuri L. ; Paratte, Jérôme ; Bhatia, Peeyush ; Künzli, Serge
Author_Institution :
Ismeca Semicond. S.A., La Chaux-de-Fonds, Switzerland
fDate :
Nov. 30 2010-Dec. 2 2010
Abstract :
Most bumped packages (WL-CSPs, BGAs, etc) undergo the necessary 3D visual inspection in tray-scan machines or at the wafer level, or sometimes there is no 3D inspection, relying on process stability and correlation with 2D inspection alone. This means the device are further manipulated before they are placed into tape, and there is the risk of them being actually damaged. This risk is more important as bumps become smaller.
Keywords :
automatic optical inspection; ball grid arrays; electronic engineering computing; fatigue cracks; image resolution; phase shifting interferometry; production engineering computing; semiconductor device manufacture; surface topography; wafer level packaging; 2D collocated inspection; 2D image resolution; 3D measurement; 3D visual inspection; 3DFlex; BGA; Ismeca field-bus machine; NativeNET vision system; VGA camera; WL-CSP; ball standoff; bump diameter; bump pitch; bump presence; bump standoff; bump volume; bumped device; bumped die; bumped package; flexible system; full-image topographic measurement; image pixel; projection moire phase shift interferometry; single-station vision module; surface inspection; taping module; total visual inspection; touchless 3D; tray-scan machine; wafer level; Image coding; Inspection; Interferometry; Shape measurement; Stacking; Three dimensional displays; Throughput;
Conference_Titel :
Electronic Manufacturing Technology Symposium (IEMT), 2010 34th IEEE/CPMT International
Conference_Location :
Melaka
Print_ISBN :
978-1-4244-8825-4
DOI :
10.1109/IEMT.2010.5746679
