3DFlex: A flexible system for total visual inspection of bumped devices

Author

De Meneses, Yuri L. ; Paratte, Jérôme ; Bhatia, Peeyush ; Künzli, Serge

Author_Institution

Ismeca Semicond. S.A., La Chaux-de-Fonds, Switzerland

fYear

2010

fDate

Nov. 30 2010-Dec. 2 2010

Firstpage

1

Lastpage

4

Abstract

Most bumped packages (WL-CSPs, BGAs, etc) undergo the necessary 3D visual inspection in tray-scan machines or at the wafer level, or sometimes there is no 3D inspection, relying on process stability and correlation with 2D inspection alone. This means the device are further manipulated before they are placed into tape, and there is the risk of them being actually damaged. This risk is more important as bumps become smaller.

Keywords

automatic optical inspection; ball grid arrays; electronic engineering computing; fatigue cracks; image resolution; phase shifting interferometry; production engineering computing; semiconductor device manufacture; surface topography; wafer level packaging; 2D collocated inspection; 2D image resolution; 3D measurement; 3D visual inspection; 3DFlex; BGA; Ismeca field-bus machine; NativeNET vision system; VGA camera; WL-CSP; ball standoff; bump diameter; bump pitch; bump presence; bump standoff; bump volume; bumped device; bumped die; bumped package; flexible system; full-image topographic measurement; image pixel; projection moire phase shift interferometry; single-station vision module; surface inspection; taping module; total visual inspection; touchless 3D; tray-scan machine; wafer level; Image coding; Inspection; Interferometry; Shape measurement; Stacking; Three dimensional displays; Throughput;

fLanguage

English

Publisher

ieee

Conference_Titel

Electronic Manufacturing Technology Symposium (IEMT), 2010 34th IEEE/CPMT International

Conference_Location

Melaka

ISSN

1089-8190

Print_ISBN

978-1-4244-8825-4

Type

conf

DOI

10.1109/IEMT.2010.5746679

Filename

5746679