DocumentCode

2898261

Title

Building In Reliability For Packaging And Assembly

Author

Shirley, C. Glenn

Author_Institution

Intel Corporation

fYear

1992

fDate

25-28 Oct. 1992

Firstpage

57

Lastpage

68

Keywords

Assembly; Copper; Gold; Plastic packaging; Product development; Silicon; Testing; Very large scale integration; Wafer bonding; Wire;

fLanguage

English

Publisher

ieee

Conference_Titel

Wafer Level Reliability Workshop, 1992. Final Report., 1992 International

Conference_Location

Lake Tahoe, CA, USA

Type

conf

DOI

10.1109/IWLR.1992.657985

Filename

657985