DocumentCode
2898508
Title
Assembly Level Reliability
Author
Mohan, Kris
Author_Institution
Corporate Reliability Technology
fYear
1992
fDate
25-28 Oct. 1992
Firstpage
69
Lastpage
76
Keywords
Assembly; Life estimation; Manufacturing automation; Passivation; Semiconductor device packaging; Semiconductor device reliability; Semiconductor materials; Temperature; Testing; Wire;
fLanguage
English
Publisher
ieee
Conference_Titel
Wafer Level Reliability Workshop, 1992. Final Report., 1992 International
Conference_Location
Lake Tahoe, CA, USA
Type
conf
DOI
10.1109/IWLR.1992.657986
Filename
657986
Link To Document