• DocumentCode
    2898586
  • Title

    Separation of the bar: Systemic solution of runner bar cull remain problem through leadframe design change

  • Author

    Tan, Richard Chay ; Gemal, Jose Mario ; Lim, Leo

  • Author_Institution
    ON Semicond. Golden Mile Bus. Park, Cavite, Philippines
  • fYear
    2010
  • fDate
    Nov. 30 2010-Dec. 2 2010
  • Firstpage
    1
  • Lastpage
    4
  • Abstract
    With the drive to enhance Moisture Sensitivity Level for TSSOP-48L package in OSPI, plating type for this package was converted to roughened treated upgraded Pre-Plated Nickel Palladium Gold(RT-UPG PPF). The enhanced property of this plating type to adhere to the epoxy molding compound, results in processing difficulty for the runner bars to be removed from the strip. This paper will discuss in detail the systematic approach taken to resolve the problem, the design changes implemented both on the material and the tool parts. It closes on the point that with the new leadframe design a more robust process is achieved without compromising the integrity of the package and processes involved.
  • Keywords
    copper; electronics packaging; moulding; Cu; OSPI; RT-UPG PPF; TSSOP-48L package; epoxy molding compound; leadframe design change; moisture sensitivity level; plating type; pre-plated nickel palladium gold; runner bar remain problem; tool parts; Compounds; Force; Lead; Materials; Stress; Strips;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Electronic Manufacturing Technology Symposium (IEMT), 2010 34th IEEE/CPMT International
  • Conference_Location
    Melaka
  • ISSN
    1089-8190
  • Print_ISBN
    978-1-4244-8825-4
  • Type

    conf

  • DOI
    10.1109/IEMT.2010.5746701
  • Filename
    5746701