DocumentCode
2898586
Title
Separation of the bar: Systemic solution of runner bar cull remain problem through leadframe design change
Author
Tan, Richard Chay ; Gemal, Jose Mario ; Lim, Leo
Author_Institution
ON Semicond. Golden Mile Bus. Park, Cavite, Philippines
fYear
2010
fDate
Nov. 30 2010-Dec. 2 2010
Firstpage
1
Lastpage
4
Abstract
With the drive to enhance Moisture Sensitivity Level for TSSOP-48L package in OSPI, plating type for this package was converted to roughened treated upgraded Pre-Plated Nickel Palladium Gold(RT-UPG PPF). The enhanced property of this plating type to adhere to the epoxy molding compound, results in processing difficulty for the runner bars to be removed from the strip. This paper will discuss in detail the systematic approach taken to resolve the problem, the design changes implemented both on the material and the tool parts. It closes on the point that with the new leadframe design a more robust process is achieved without compromising the integrity of the package and processes involved.
Keywords
copper; electronics packaging; moulding; Cu; OSPI; RT-UPG PPF; TSSOP-48L package; epoxy molding compound; leadframe design change; moisture sensitivity level; plating type; pre-plated nickel palladium gold; runner bar remain problem; tool parts; Compounds; Force; Lead; Materials; Stress; Strips;
fLanguage
English
Publisher
ieee
Conference_Titel
Electronic Manufacturing Technology Symposium (IEMT), 2010 34th IEEE/CPMT International
Conference_Location
Melaka
ISSN
1089-8190
Print_ISBN
978-1-4244-8825-4
Type
conf
DOI
10.1109/IEMT.2010.5746701
Filename
5746701
Link To Document