DocumentCode
2898707
Title
The Use of Special Purpose Assembly Test Chips for Evaluating Reliability in Packaged Devices
Author
Sweet, James N.
Author_Institution
Sandia National Laboratories
fYear
1992
fDate
25-28 Oct. 1992
Firstpage
77
Lastpage
82
Keywords
Assembly; Moisture; Packaging; Passivation; Pollution measurement; Semiconductor device measurement; Testing; Textile industry; Thermal resistance; Thermal stresses;
fLanguage
English
Publisher
ieee
Conference_Titel
Wafer Level Reliability Workshop, 1992. Final Report., 1992 International
Conference_Location
Lake Tahoe, CA, USA
Type
conf
DOI
10.1109/IWLR.1992.657987
Filename
657987
Link To Document