DocumentCode :
2898707
Title :
The Use of Special Purpose Assembly Test Chips for Evaluating Reliability in Packaged Devices
Author :
Sweet, James N.
Author_Institution :
Sandia National Laboratories
fYear :
1992
fDate :
25-28 Oct. 1992
Firstpage :
77
Lastpage :
82
Keywords :
Assembly; Moisture; Packaging; Passivation; Pollution measurement; Semiconductor device measurement; Testing; Textile industry; Thermal resistance; Thermal stresses;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Wafer Level Reliability Workshop, 1992. Final Report., 1992 International
Conference_Location :
Lake Tahoe, CA, USA
Type :
conf
DOI :
10.1109/IWLR.1992.657987
Filename :
657987
Link To Document :
https://search.ricest.ac.ir/dl/search/defaultta.aspx?DTC=49&DC=2898707
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